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electrical connector Hanbo Electronic WAFER-HY200JK-8A with brass contacts and nickel tin plating

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electrical connector Hanbo Electronic WAFER-HY200JK-8A with brass contacts and nickel tin plating

Pitch : 2mm

Flame Retardant Rating : UL94V-0

colour : 白色

Number of Rows : 1

Reference Series : HY

Operating Temperature : -25℃~+85℃

Plastic Material : PA66

Number of PINs Per Row : 8

With Locker : 带锁扣

Description : Connector Housing 8 Position 2mm Pitch Single Row HY Series PA66 -25℃~+85℃

Mfr. Part # : WAFER-HY200JK-8A

Package : P=2mm

Model Number : WAFER-HY200JK-8A

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Product Overview

This product features brass contacts plated with nickel and tin, housed in a white LCP/PA66 (UL94V-0) base. It is designed for electrical applications with a rated voltage of 250V AC/DC and a rated current of 2.0A AC/DC. The product meets stringent technical requirements including low contact resistance (10m), high insulation resistance (1000M), and excellent dielectric strength (1000V AC/Minute). It operates within a temperature range of -25C to +85C and is RoHS compliant, ensuring environmental safety. The suggested PCB layout is provided for easy integration.

Product Attributes

Base/Wafer Material: LCP/PA66 (UL94V-0)
Contact Material: Brass
Plating: Nickel underplating, Tin plating (30U"MIN base, 80UMIN re-tinning)
Color: White
Environmental Compliance: Meets requirements for lead, cadmium, and six other hazardous substances.

Technical Specifications

Specification	Value
Plastic Part Material	LCP/PA66 (UL94V-0)
Contact Plating	Nickel underplating, Tin plating (30U"MIN base, 80UMIN re-tinning)
Contact Resistance	10m
Insulation Resistance	1000M
Rated Voltage	250V AC/DC
Rated Current	2.0A AC/DC
Withstand Voltage	1000V AC/Minute
Operating Temperature	-25C to +85C
Solderability Test (Immersion)	95% tinning area, 220C 5C, 2.5 0.5 seconds
Dimensions (Base/Wafer)	5.100.2 mm (Width) x 4.000.15 mm (Depth)
Contact Diameter	0.500.05 mm
Pitch	2.000.10 mm
Overall Height	80.2 mm
PCB Layout Hole Diameter	0.70.10 mm
PCB Layout Hole Spacing	2.000.10 mm
PCB Layout Pad Size (A0.20)	3.40.3 mm

2410121223_Hanbo-Electronic-WAFER-HY200JK-8A_C22374511.pdf

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