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Robust Electrical Connector FOXCONN AS0A821-H2SB-7H DDR4 SO DIMM 260 Pin 5.2mm Height Memory Module

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Robust Electrical Connector FOXCONN AS0A821-H2SB-7H DDR4 SO DIMM 260 Pin 5.2mm Height Memory Module

DDR Type : SO-DIMM

DDR SDRAM Standard : DDR4

Number of Pins : 260P

Operating Temperature : -55℃~+85℃

Description : 260P Inline Module Sockets RoHS

Mfr. Part # : AS0A821-H2SB-7H

Model Number : AS0A821-H2SB-7H

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Product Overview

This DDR4 SO DIMM Connector is designed for memory module applications, offering a standard 5.2mm height and a 260-pin configuration. It is engineered for reliability and performance in computing systems, featuring robust electrical and mechanical characteristics suitable for demanding environments. The connector supports high-speed data transfer and is built to withstand a significant number of mating cycles, making it ideal for integration into various memory solutions.

Product Attributes

Brand: FOXCONN INTERCONNECT TECHNOLOGY LIMITED.
Product Series: DDR4 SO DIMM CONN.
Part Number: AS0A82*-H2SB-7H
Color: Black
Material (Housing): Thermoplastic UL94V-0, Halogen Free
Material (Contact): Copper Alloy
Material (Metal Pad): Stainless Steel
Material (Metal Spring): Stainless Steel
Plating Options (Contact Area): Gold Flash, 5" Gold, 10" Gold, 15" Gold, 30" Gold
Plating (Tail): Gold Flash
Plating (Nickel Under): 50" (Contact), 10" (Metal Pad)
Plating (Matte Tin): 100" (Over Solder Pad Area)
Certifications: UL94V-0
Compliance: Halogen Free

Technical Specifications

Specification	Value
Number of Positions	260
Connector Type	DDR4 SO DIMM
Standard Height	5.2 mm
Contact Current Rating	0.5 Ampere MAX. per pin
Voltage Rating	25V AC
Insulation Resistance	100 Megaohms MIN. at 500V DC
Dielectric Withstanding Voltage	250V AC RMS at 60Hz, for 1 minute
Contact Resistance (Initial)	60 Milliohms MAX. per pin
Contact Resistance (After Environmental Testing)	10 Milliohms MAX. per pin
Durability	60 Mating Cycles
Operation Temperature	-55C to +85C
SMT Peak Temperature	260C for 10~20 seconds
Overall Dimensions (Width)	70.00 0.15 mm
Overall Dimensions (Length)	72.1 mm
Overall Dimensions (Height)	5.4 mm
PCB Layout Thickness (Recommended)	1.40 mm
Carrier Tape Hole Pitch Cumulative Tolerance	0.20mm
Cover Tape Peeling Strength	0.01 kgf MIN. to 0.15 kgf MAX. at 300mm/min
Packing Capacity	310 PCS/Reel, 3 Reels/Box (930 PCS/Box)

2410121805_FOXCONN-AS0A821-H2SB-7H_C2832345.pdf

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